載入中……
[供應]Indium8.9HF1/88.25/SAC305/TYPE4
- 產品產地：
- 產品品牌：
- 包裝規(guī)格：
- 產品數(shù)量：0
- 計量單位：
- 產品單價：0
- 更新日期：2025-02-05 11:35:29
- 有效期至：2026-02-05
-
-
- 收藏此信息
Indium8.9HF1/88.25/SAC305/TYPE4
詳細信息
Introduction
Indium8.9HF-1isanairreflow，no-cleansolderpaste.Indium8.9HF-1offersunprecedentedstencilprinttransferefficiencytoworkinthebroadestrangeofprocesses.Inaddition，thehighprobetestabilityofIndium8.9HF-1minimizesfalsefailuresinICT.
Alloys
IndiumCorporationmanufactureslow-oxidesphericalpowdercomposedofavarietyofPb-freealloysthatcoverabroadrangeofmeltingtemperatures.ThisdocumentcoversType4andType3powderasstandardofferingswithSACalloys.Themetalpercentistheweightpercentofthesolderpowderinthesolderpasteandisdependentuponthepowdertypeandapplication.Standardproductofferingsaredetailedinthefollowingtable.
Features
?HighoxidationbarriertoeliminategrapingandHIPdefects
?Highlyprobetestablefluxresidue
?Halogen-freeperEN14582testmethod
?Excellentprinttransferefficiencyon0.4mmpitchCSPs
CompatibleProducts
?ReworkFlux:TACFlux?089HF，TACFlux?020B
?CoredWire:CW-807
?WaveFlux:WF-9945，WF-9958
Note:Otherproductsmaybeapplicable.PleaseconsultoneofIndiumCorporation’sTechnicalSupportEngineers.
Cleaning
Indium8.9HF-1isdesignedforno-cleanapplications，howeverthefluxcanberemovedifnecessarybyusingacommerciallyavailablefluxresidueremover.
StencilCleaningisbestperformedusingisopropylalcohol(IPA)asasolvent.Mostcommerciallyavailablenon-water-basedstencilcleanersworkwell.
Printing
StencilDesign:
Electroformedandlasercut/electropolishedstencilsproducethebestprintingcharacteristicsamongstenciltypes.Stencilaperturedesignisacrucialstepinoptimizingtheprintprocess.Thefollowingareafewgeneralrecommendations:
?Discretecomponents—A10-20%reductionofstencilaperturehassignificantlyreducedoreliminatedtheoccurrenceofmid-chipsolderbeads.The“homeplate”designisacommonmethodforachievingthisreduction.
?Finepitchcomponents—Asurfaceareareductionisrecommendedforaperturesof20milpitchandfiner.Thisreductionwillhelpminimizesolderballingandbridgingthatcanleadtoelectricalshorts.Theamountofreductionnecessaryisprocessdependent(5-15%iscommon).
?Foroptimumtransferefficiencyandreleaseofthesolderpastefromthestencilapertures，industrystandardapertureandaspectratiosshouldbeadheredto.
同類型其他產品
免責聲明：所展示的信息由企業(yè)自行提供,內容的真實性、和合法性由發(fā)布企業(yè)負責,浙江民營企業(yè)網對此不承擔任何保證責任。
友情提醒：普通會員信息未經我們人工認證，為了保障您的利益，建議優(yōu)先選擇浙商通會員。
浙江民營企業(yè)網 www.mnzi.cn 版權所有 2002-2010